光触媒およびUVを前処理に用いた導電微粒子の作製

抄録

As electronic devices are miniaturized, connection reliability between the Liquid Crystal Display (LCP) and the device becomes increasingly important. Anisotropic conductive film has been widely used to form the connection between the chip and the glass substrate. In this paper, we report the applicability of ultraviolet light irradiation, using a photocatalysis process to modify the surface of the non-conductive resin particles. A uniform and adhered nickel deposition can be achieved with TiO₂ as the photocatalyst. However, separating the TiO₂ from the treated resin particles can be difficult. We were able to solve this problem by introducing ZnO as a photocatalyst, since the ZnO particles are easily dissolved by an acid and alkaline solution.