エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
研究論文・速報論文
不溶性アノードによる硫酸銅めっき添加剤消耗原因の検討
萩原 秀樹小合 康裕石川 久美子君塚 亮一
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2009 年 12 巻 6 号 p. 551-556

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It is widely known that the use of insoluble anodes result in a greater quantity of additive consumption than phosphorised copper anodes. Consequently, the insoluble anode is covered with a permeable membrane in use, but recently, insoluble anodes that do not cause considerable additive consumption without permeable membrane have been reported. This paper reports on the result of our study on the cause of substantial additive consumption that results from the use of insoluble anodes. As a result of the study, it is clearly suggested that in the acid copper plating bath containing chloride ions, hypochlorite is generated at the surface of the insoluble anode by the chloride oxidation reaction, and the hypochlorite decompose the additives by oxidation.

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