Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Packaging Technology
Experimental Assessment of Electronic Package Deformation Using Digital Image Correlation Technique
Jae B. Kwak, Soonwan Chung
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2011 Volume 14 Issue 5 Pages 422-426

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[in Japanese]

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© 2011 The Japan Institute of Electronics Packaging
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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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