エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
技術報告
均質化法を用いたBGAパッケージの反り挙動予測
鈴木 智久寺崎 健田中 俊明竹越 正明
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ジャーナル フリー

2013 年 16 巻 1 号 p. 70-76

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We developed a simple method for accurately predicting the warpage of the ball grid array (BGA) interposer in consideration of the wiring layers. In recent years, this interposer has become thinner, so the influence of the wiring layers has become larger. Consequently, modeling the wiring layers is important for predicting the warpage of the BGA package. However, detailed modeling of the wiring layers causes an increase of the analysis scale. For this reason, we calculated the anisotropic material properties of the wiring layers using the homogenization method. From this, we reveal that it is possible to achieve the same precision as that of a real wiring shape model while decreasing the analysis scale by using this method. We also reveal that this method is effective for high temperatures.

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© 2013 一般社団法人エレクトロニクス実装学会
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