エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
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Pbフリーはんだ接続部のエレクトロマイグレーション現象解明の基礎研究
藤吉 優千綿 伸彦Han Jung KyuTu King-Ning
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2013 年 16 巻 2 号 p. 159-163

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In flip chip technology, electromigration affects the reliability of the solder interconnections. When investigating electromigration in the solder joint, it is essential to examine the effective charge number (Z*) of the atoms involved in the electromigration. In this study, first, a solder joint with almost equivalent current crowding on electromigration was produced by using 1mm thick Cu plates. After that, nine markers were formed on the cross-sectioned solder joint. Then, the migration length of each marker was systematically measured under two conditions. The Z* of each marker was examined by the marker's migration length.

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