エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
速報論文
高温動作に対応したサンドイッチ型ワイヤボンドレスSiCパワーモジュールの作製技術
加藤 史樹郎 豊群Simanjorang Rejeki仲川 博山口 浩佐藤 弘
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2013 年 16 巻 4 号 p. 300-304

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A wire bond-less SiC power module with sandwich structure is proposed for use in high-temperature devices. The module is composed of two SiC-transistors and two SiC-diodes, which are sandwiched between two ceramic circuit boards. The devices are bonded on the circuit boards using a sintered material (submicron Au paste) with a precise alignment (within ±5 μm) and height control (within ±7 μm). These two circuit boards are soldered with Au-12%Ge solder, resulting in a structured sandwich module within a tilting level of 15 μm/11-mm-substrate. No damage is observed on the devices and internal connections in the module even after 500 cycles of a thermal cycling test (-40°C~250°C).

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