Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
A Wiring Implementation Technology to Reduce the Inductance of the Power Module
Kinya NakatsuHideki MiyazakiRyuichi SaitoJin Ohnuki
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JOURNAL FREE ACCESS

2015 Volume 18 Issue 4 Pages 270-278

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Abstract
Recent advances in downsizing inverters have made it necessary to reduce the surge voltage which can cause trouble in a high-speed power semiconductor that generates a square-wave electric current. Reduction of the wiring inductance between the capacitor and the power module was necessary to reduce the surge voltage. We developed a low-inductance layout technique where an eddy current flows through the cooling plate efficiently using a loop layout for the wiring of the power module. The magnetic flux of the eddy current reduces the wiring inductance by countering the magnetic flux of the wiring. We confirmed that approximately 0.11 times at 1 MHz of the square-wave electric current could reduce the wiring inductance of the trial manufacture power module.
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© 2015 The Japan Institute of Electronics Packaging
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