エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
技術報告
銅ダマシン法により作製した半導体デバイス用配線材料の信頼性解析のための接点接続状態の交流インピーダンス法による評価
柴沼 亮佑吉原 佐知雄
著者情報
ジャーナル 認証あり

2016 年 19 巻 3 号 p. 184-188

詳細
抄録

A semiconductor chip was evaluated and analyzed using the AC impedance method in this report. The aim of this study is to establish an evaluation method for EM. An appropriate current density was applied to the TEG sample fabricated using a copper damascene method. Concurrently, the AC impedance was measured by use of a frequency response analyzer before and after the EM test. Additionally, the occurrence of electromigration was observed after the test using a digital microscope. We succeeded in observing the change in the form of the Cole-Cole plot of the AC impedance after EM. However, this is considered to be evidence of the change in the contact state of the wire and the copper plate. It is suggested that the change in the contact state derived from the energization could be monitored using an AC impedance method. Thus, this method will be applicable to estimating the contact state when performing an EM evaluation.

著者関連情報
© 2016 一般社団法人エレクトロニクス実装学会
前の記事 次の記事
feedback
Top