エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
技術報告
低弾性プリプレグによるはんだクラック低減検討
串田 圭祐富岡 健一平山 雄祥
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2019 年 22 巻 1 号 p. 119-123

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In recent years, hybrid vehicles, which use advanced electronic controls, are increasing. As the Engine Control Unit (ECU) has come to be mounted in the engine compartment, solder cracking resulting from the stress due to the mismatching CTE (Coefficient of Thermal Expansion) between electronic and PCB has become an issue. Low elastic modulus material was developed to solve this issue.

Low elastic prepreg has a low elastic modulus and high elongation, and also has high reliability properties in CAF (Conductive Anodic Fliament) and heat resistance. Low elastic modulus material applied to the surfaces of PWBs of standard FR-4 material inhibits solder cracking, absorbing the soldering stress.

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