Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Interposer Technology
The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration
Osamu Shimada
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2019 Volume 22 Issue 5 Pages 361-366

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© 2019 The Japan Institute of Electronics Packaging
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