Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Thermal Management of Electronics—Research Trends and Standard Development Activities—
Semiconductor Package Modeling at JEITA and Extension to IEC Standard
Koji Nishi, Yutaka Kumano, Takuya Shinoda, Ken Miyazaki
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2021 Volume 24 Issue 2 Pages 188-192

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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