1998 年 1 巻 2 号 p. 124-129
Authors developed a new wiring board which is bonded between each layers and is connected with vias electrically by simultaneous thermocompression method. The layers are producted from the copper laminated polyimide tape and the vias are connected with two different method, i.e. conductive adhesives or sordering with Au/Sn alloy. This paper discribes the outline of these wiring board formation process and the comparison results of the vias connection reliabilty under temperature cycling test.