エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
電解Ni/Auめっきを用いたBGA鉛フリーはんだ接合部の衝撃信頼性におよぼすNiめっき条件の影響
山本 健一赤星 晴夫加藤 隆彦川村 利則小泉 正博木本 良輔佐藤 了平
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2007 年 10 巻 4 号 p. 305-313

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Tests were performed to evaluate the impact strength and analyze the fracture mechanism of Sn-3mass%Ag-0.5mass%Cu solder joints on electroplated Ni/Au BGAs. The impact strength of solder joints deteriorates with higher concentrations of impurities (Cl, S, C) in the Ni plating film on the BGA substrates. These impurities are mixed into the Ni plating film during the plating process, and the concentration of the impurities is increased by Ni plating bath contamination ascribed to the solder mask of the BGA substrates. To improve the impact strength of the BGA solder joints, we must lower the concentration of these impurities in the Ni plating film. This requires 1) selection of a solder mask material that does not contaminate the Ni plating bath, 2) prevention of contamination from other sources, and 3) sanitization of the plating bath.

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