2008 年 11 巻 2 号 p. 152-156
Achieving the high performance required today from electronic devices such as cellular phones and personal computers requires greatly increased signal processing speed. This means that a substrate material with excellent electrical properties also is required. One such material is liquid crystalline polymer (LCP) . Generally, a high alkaline solution and a dry process are used to pre-treat the LCP, to form a conductive layer. However, this pre-treatment does not create good adhesion strength. In this study, we attempted to form a conductive layer with good adhesion strength by employing a surface modification technique that used UV irradiation. The results showed that an adhesion strength of about 0.8kN⋅m-1 can be achieved under optimum conditions. The surface roughness after surface modification was about 0.08μm in Rz. This surface was very smooth, compared with that produced by the conventional method.