エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
多重磁極マグネトロンスパッタ法により作製したCo及びCu薄膜の電磁波シールド効果
村岡 裕紀武田 健吾熊渕 善太河合 克浩川畑 敬志本多 茂男
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2008 年 11 巻 3 号 p. 228-230

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Electromagnetic wave shield characteristics were studied for Co and Cu thin films prepared by magnetron sputtering with multipolar magnetic plasma confinement (MMPC) . The characteristics were measured utilizing the Kansai Electronic Industry Development Center (KEC) Method. Results show that the electric field and magnetic field shield effects depend significantly on the thickness of the Co and Cu thin films. The shielding effectiveness of 1 μm-thick deposited Co films for electric and magnetic fields was 69 dB and 51 dB, respectively, measured at 800 MHz. For Cu films, the effectiveness was 77 dB and 61 dB, respectively. It was demonstrated that the electromagnetic wave shield effeet of Co and Cu thin films, which is dependent upon the film thickness, is the result of attenuation loss and the skin effect.

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