Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
Embedded Die Technology Breakthrough: The Redistributed Chip Package
Beth KESERCraig AMRINEGeorge LEALWilliam LYTLEDoug MITCHELLRobert WENZEL
Author information
JOURNALS FREE ACCESS

2008 Volume 11 Issue 4 Pages 280-284

Details
Abstract

[in Japanese]

Information related to the author
© The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top