エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
PETフィルム上への密着性に優れた銅回路形成技術
松井 貴一渡辺 充広杉本 将治北村 佳子太田 哲司本間 英夫
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2008 年 11 巻 7 号 p. 540-543

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In recent years, as electronic devices have become smaller and multi-functionalized, printed wiring boards (PWBs) have required correspondingly higher density and more integration. Generally, organic materials are used as the insulating material on PWBs. The formation of a conductive layer for wiring on these insulators is a key technology. In particular, a conductive layer with excellent adhesion strength is needed for manufacturing fine-pitch PWBs. We studied the formation of a conductive layer on PET film without the roughening of the resin surface associated with conventional oxidizing agents. A thin layer of hydrophilic polymer was formed on the surface of the PET film, followed by electroless copper plating. The sample obtained by subsequent electroplating had sufficient adhesion strength of 0.8 kN/m.

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