Blind Via Formation with Solid-State Ultraviolet Laser Using Imaging/Shaping Technique

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Blind Via Formation with Solid-State Ultraviolet Laser Using Imaging/Shaping Technique

Hisashi MATSUMOTO, Corey DUNSKY, Glenn SIMENSON

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Keywords: Laser Drilling, Laser Material Process, Solid-State Ultraviolet Laser

JOURNAL FREE ACCESS

2001 Volume 4 Issue 6 Pages 504-508

DOI https://doi.org/10.5104/jiep.4.504

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[in Japanese]

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© The Japan Institute of Electronics Packaging

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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