エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
Fan-outタイプCSP (Chip Scale Package) の構造信頼性設計
田中 直敬寺崎 健北野 誠春田 亮橋爪 孝則
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2001 年 4 巻 6 号 p. 509-514

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We developed a highly reliable fan-out-type chip scale package (CSP) for a microcomputer or an ASIC (Application Specific IC) . We found that the solder joint reliability of the CSP under temperature cycling is equal to that of a quad flat package (QFP) and that its mechanical strength (determined from a board-bending test) is much higher than that of a QFP. The fatigue life of a Sn-Ag-Cu lead-free CSP solder joint determined from a cyclic board-bending test is almost equal to that of a Sn-37Pb CSP solder joint. Moreover, compared to a QFP, the occupied area of a CSP is decreased by 75% and its weight is decreased by 90%.

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