2001 年 4 巻 7 号 p. 625-628
The dry film solder resist, named CFP1122, has been developed for tape CSP. This material mainly consists of thermosetting resin and photosensitive resin. This film can be easily laminated on uneven copper circuits without bubble by using the vacuum laminator. Though this resin is able to dissolve into the TMAH (tetramethyl- ammonium hydroxide) aqueous solution, this material can be developed without the infection of ionizable impurities with this resin. Also, the cured film has good properties as solder resist.