エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
パッケージ用有機材料から溶出するビスフェノールAの定量分析
竹ノ内 敏一佐藤 美弥子村松 みゆき横川 秀希若林 信一
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2002 年 5 巻 1 号 p. 54-57

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As an endocrine disrupting chemical, bisphenol-A has been paid much attention from the view point of environmental protection. Bisphenol-A has been used for producing polycarbonate and epoxy resins as their main constituent, and those are widely accepted as a substrate and package for semiconductor industries. Nowadays, it is important to analyze bisphenol-A which was leached from the organic materials used for electronic devices. In this study, the analysis was conducted with the procedure of Japan Society for Environmental Chemistry, and evaluated 4 kinds of PWBs (printed wiring boards), 2 kinds of mold resins, solder resists and insulation resins for build up substrates. To extract the bisphenol-A into water, samples were soaked in the water for 1 hour at 50°C or for 1 week at room temperature in the dark, and the amount of bisphenol-A was determined by gas chromatography/mass spectrometry (GC/MS) measurement. As a result of the analysis, it was found that the max. amount of bisphenol-A leached from a PWB sample was 212 ng/g. Furthermore, it was revealed that the analysis data showed big difference between the each materials, PWB, mold resins and solder resists. A PWB material which is not composed with epoxy material was detected no bisphe-nol-A as expected reasonably.

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