エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
樹脂封止ICのワイヤ流れに対するワイヤ配置の影響
高堂 積有田 宏志宮本 琢也大野 恭秀
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2002 年 5 巻 1 号 p. 64-67

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Semiconductor package has been become more complex structure, including wiring technique. And, matter of wire sweep due to resin flow in encapsulation begins to be more complicated again. It first the distribution of wire sweep in QFP was investigated. Then, it was examined fundamentally about some kinds of influence on encapsulation conditions. And, computer simulation was done about that result. Furthermore, we studied on pressure inside cavity for the wire sweep.

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