エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ULSI配線形成におけるステップ式電解波形制御の有効性
小山田 仁子三浦 修平本間 英夫
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2002 年 5 巻 1 号 p. 79-81

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Copper electroplating is greatly interested in ULSI technology because of copper damascene process. We have already reported that void-free copper fill can be achieved by the selection of proper additives. However, inclusion of additives in copper deposit may cause deposit deterioration. A possibility of copper filling by the wave form control was examined using additive free bath. The void-free filling can be achieved by current density in stepwise current wave form by changing from lower to higher current.

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