2002 年 5 巻 3 号 p. 278-282
Recently, demands for card-type Products has be growing. So, package is demanded not only to be smaller and lighter. But also its thickness is needed to be extremely thin. We have developed an ultra-thin package (0.5h-FLGA) with a package thickness of 0.5mm (Max) . The technical features and characteristics are described in this paper.