2002 年 5 巻 3 号 p. 283-287
We have evaluated the joint reliability of some kinds of components jointed with Zn system solder. The tested components were CSPs with Sn-Ag-Cu-Bi solder balls, TSOPs with some platings, and Chip components with some platings. The evaluation was carried out by the temperature cycle test (TCT) . As the results, in case of CSPs, we obtained good joint resistance even after TCT 2000cycles. And also in the case of Chip components, we obtained good joint strength even at 1000cycles. On the other hands, in the case of TSOPs, the joint strength TSOP which has 42alloy lead plated with Sn-Pb was weaken.