エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
ソルダレジストコーティングを施したプリント配線板導体箔間のサージ絶縁耐力
永嶋 義行馬場 旬平首藤 克彦正田 英介
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2002 年 5 巻 6 号 p. 609-612

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Recently miniaturization and performance enhancement of electronic equipment are remarkable. The gap between the conductors on a printed circuit board becomes much smaller, and the high insulation reliability is required for the printed circuit board. In the printed circuit board, it is also abounding in the opportunity of which various surge are applied, and it is abounding of printed circuit board of which the inverter surge is always applied by the development of recent power electronics. From such background, surge dielectric strength between printed circuit board conductive foil was examined. The experiment was carried out by FR-4 model printed circuit board. As a result, surge dielectric strength of the 0.03mm-0.5mm gap length sample was 0.2kV-2.5kV. In the sample with solder resist coating, surge dielectric strength between conductive foil was 9kV-10.5kV.

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