X線CT装置による樹脂封止型IC内部のワイヤ形状3次元計測
2002 年 5 巻 7 号 p. 683-688
詳細
2002 年 5 巻 7 号 p. 683-688
As for the inside analysis of a semiconductor device, we observed the wire sweep of plastic package by a newly developed X-ray CT instrument. We could observe the three-directional configuration of the bonding wire of encapsulated QFP by composing two-dimensional cross section CT scan image. By this new method, we got more smooth wire profiles than the result we observed before.
