エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
圧接構造フリップチップ実装技術を用いた積層パッケージング技術の開発
西田 一人清水 一路油井 隆本間 太松村 信弥岡本 泉阿部 光治高田 耕造江間 富世古口 日出男佐々木 智江
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2002 年 5 巻 7 号 p. 693-700

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A stacked device called SEP (System Embedded Package) was developed to drastically increase LSI density relative to its area on the circuit board. This was achieved by fabricating an LSI package in a stacked structure. This device has been applied to mobile communication equipment. The bottom-side chip was made into a flip-chip structure and attached to the substrate by the NSD method, which involves the use of stud-bumps and adhesive encapsulation film. On the top of this flip-chip LSI, another LSI was stacked and interconnected by using low-profile wire-bonding technology. The use of flip-chip bonding for the bottom-side LSI permitted easy wire bonding on the topside LSI. Furthermore, this packaging technology was able to provide a super multi-pin system LSI with more than 600 pins. By adopting this package in a mobile communication product, the required package area on the circuit board could be reduced by 35%.

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