エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
仮想環境下における鉛はんだおよび鉛フリーはんだからの溶出挙動
原 美永子中澤 克仁片山 恵一坂村 博康安井 至
著者情報
ジャーナル フリー

2003 年 6 巻 2 号 p. 173-176

詳細
抄録

The elution characteristics of lead from the printed circuit boards in the MD players were investigated, and it was confirmed that the amount of lead eluted from the printed circuit board using Sn96- Ag2.5-Bi1.0-Cu0.5 solder was smaller than that from the printed circuit board using Sn63-Pb37 solder. The elution of elements (tin, bismuth, silver, copper and lead) from five kinds of lead-free solders and the lead solder were measured under various pseudo-environments (pure water, 3.5 wt% salt solution and pH 3 acid solution) . These results indicated that the amount of each element eluted from several solders was especially large under the acid solution.

著者関連情報
© 一般社団法人エレクトロニクス実装学会
前の記事 次の記事
feedback
Top