エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
はんだ接合強度に及ぼす無電解ニッケル-置換金めっきプロセスの影響
山本 智之渡辺 秀人伊澤 和彦本間 英夫
著者情報
ジャーナル フリー

2003 年 6 巻 4 号 p. 339-344

詳細
抄録

Electroless nickel plating has been applied for the formation of electronics circuits due to the downsizing of electronic components. However, solderability of electroless deposited nickel films is usually inferior to that of electrolytic deposited nickel films. In this paper, we focused on the relationship between the strength of solder joint and deposited nickel condition. Thickness of P-rich layer and morphology of the deposited nickel films affect the strength of solder joint. It was found that P-rich layers are formed at the subsurface of the deposited nickel and these layers are significantly changed after treatment of gold displacement. The strength of solder joints increases with decreasing P-rich layer. In this study, we found that the deposit condition of electroless nickel film also influences on the strength of solder joint.

著者関連情報
© 一般社団法人エレクトロニクス実装学会
前の記事 次の記事
feedback
Top