エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
エンボステープパッケージングにおける電子デバイスの帯電問題
藤村 徹夫清水 美基雄鍋田 健司川田 正寿岡本 彰夫
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2003 年 6 巻 4 号 p. 345-348

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Recent electric devices, such as LEDs and chip resistances are remarkably decreasing their sizes. Such small devices may be attached to packed cover tape, however, when the tape is removed in an assembly process. This problem often remains even if cover tape is treated with antistatic agents or electroconductive materials because these devices are also charged by contact or friction with cover tape. Alternative packaging materials are required to suppress electrostatic force generated with electric devices.

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