A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load

Abstract

A design method for quantitatively estimating the life of lead free solder joints in ball-grid-array-type packages under impact load was developed by an experimental result and a calculation of the finite element method. It was found that the interfacial stress between the solder and copper plating in the solder joints is the most important structural parameter in the life estimation of the solder joints. It was also found that the package structure, such as the layout of the solder bumps and the assembly temperature, has a significant effect on the life of the solder joints.