2004 年 7 巻 3 号 p. 271-275
We have fabricated copper refined wiring pattern of super connect level on polyimide. We prepared it by means of semi-additive process, which enabled flat connection between copper pattern and polyimde. The aim of this paper is the evaluation of durability for ionic migration on above newly developed sample under high temperature and high humidity (85°C, 85%RH) . We adopted mainly AC impedance method for the analysis of ionic migration. In consequence, incidence of ionic migration was confirmed. By measuring charge transfer resistance by this method, incidence of ionic migration and initial defects of electrodes could be detectable.