エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
多層回路板製造工程におけるビアホールの3次元形状計測
宮下 宏明金田 一小川 毅彦
著者情報
ジャーナル フリー

2004 年 7 巻 4 号 p. 333-338

詳細
抄録

In multi-layer printed circuit boards, many through-holes and via-holes coexist for electrical connection. This paper considers the three dimensional shape measurement of a via-hole and its environmental surface by using a laser displacement meter. The dispersion of the obtained data is caused by the affection of measuring surface. We make smoothing of the measurement data by the two methods of moving average and polynomial approximation. The usefulness of our approach is verified by experiment results.

著者関連情報
© 一般社団法人エレクトロニクス実装学会
前の記事 次の記事
feedback
Top