2004 年 7 巻 4 号 p. 333-338
In multi-layer printed circuit boards, many through-holes and via-holes coexist for electrical connection. This paper considers the three dimensional shape measurement of a via-hole and its environmental surface by using a laser displacement meter. The dispersion of the obtained data is caused by the affection of measuring surface. We make smoothing of the measurement data by the two methods of moving average and polynomial approximation. The usefulness of our approach is verified by experiment results.