2004 年 7 巻 7 号 p. 629-634
Efforts to reduce the size and increase the density of electronics devices have been accelerated. As one solution, ACF (Anisotropic Conductive Film) has drawn attention for its capability in advanced high density packaging. Though the manufacturing process is simple, the problem of open and/or short circuits occurs and no detailed analysis on this problem has been reported. In this paper, the deformation of conductive particles at ACF connection is studied in detail with TEM (Transmission Electron Microscopy) . The results are discussed with the numerical analysis. It is pointed out that the optimization of such process parameters as temperature and pressure is important. The advantage of combining physical analysis and numerical analysis is emphasized.