2006 年 9 巻 3 号 p. 180-185
Decrease in process yield in acid copper plating is usually attributed to the great number of items that should be controlled. Consequently, we focused our study on the IrO2/Ti insoluble anode that neither changes in size nor forms black films, and evaluated various changes in the acid copper plating solution for via-filling. From our evaluation, we found that highly pure CuO, which has a very high dissolution rate, was suitable as the salt for supplying copper ions. However, its addition increased the volumes of dissolved oxygen and organic impurities, respectively causing decomposition of a part of the additives and decreasing the via-filling performance. On the other hand, neutral diaphragms for anodes to prevent decomposition of the additives, and activated carbon treatment against the increase in the impurities were found to be effective remedies.