エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
難燃剤の化学構造と誘電正接の検討
天羽 悟永井 晃高橋 昭雄中村 吉宏
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2006 年 9 巻 6 号 p. 485-489

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The relationship between the chemical structure and dielectric loss tangent (tan δ) of various organophosphate flame retardants was studied. It was presumed that the low tan δ of organophosphate results from its structure, which retards the rotation of substituents inside the molecules. Resorcinol bis (dixylenylphosphate) (D) and 10- (2, 5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenan-threne=10-oxido (F) have chemical structures with a bulky xylene or a rigid cyclic bond, and these organophosphate compounds have a low tan S. Organophosphate (D) and (F) also work as effective flame retardants without influencing the tanδof a resin. The tan δ of cured 1, 2-bis (vinylphenyl) ethane/poly (phenylene oxide) (BVPE/PPO) resin containing 30 phr of organophosphate (D) or (F) was 0.0019-0.0022, while the average burning time was 0-1 sec.

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