2026 Volume 19 Pages E25-004-1-E25-004-7
To investigate and compare the etching behaviors of a conventional etching solution and a galvanic corrosion–inhibiting etching solution, a newly formulated solution was evaluated using the quartz crystal microbalance (QCM) technique. Particular attention was given to the influence of the gold-to– copper-plated copper area ratio (1:1 and 10:1).
During copper etching, the individual contributions of hydrogen peroxide oxidation and galvanic corrosion to the overall etching rate were quantitatively distinguished by measuring the short-circuit current. The results revealed that galvanic corrosion was effectively suppressed even at a low gold-to-copper area ratio of 1:1. Moreover, increasing the gold-to-copper area ratio significantly enhanced the etching rate due to galvanic corrosion.
