Transactions of The Japan Institute of Electronics Packaging
Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365
Technical Papers
Thermal Transient Test Based Thermal Structure Function Analysis of IGBT Package
Yafei LuoYasushi KajitaTomoyuki HatakeyamaShinji NakagawaMasaru Ishizuka
Author information

2014 Volume 7 Issue 1 Pages 20-24


In this article an IGBT package is measured using thermal transient test method following JESD 51-14 standard. In order to study the thermal structure in the package, a detailed CFD (Computational Fluid Dynamics) simulation model is also created and calibrated against the physical device using structure function. By the calibrated CFD model the package’s thermal behavior is studied. The purpose of this paper is to illustrate the process of calibrating CFD model to get a "thermally identical" representation of physical devices.

Information related to the author
© 2014 The Japan Institute of Electronics Packaging
Previous article Next article