円筒反応モデル，平板反応モデルによる溶融AlへのCuワイヤー浸漬実験，Cuプレート浸漬実験におけるCu-Al系金属間化合物生成機構の解析 ―Cu-Al混合粉末燃焼合成の理解のため―

抄録

In our previous paper, dipping experiments of Cu wires and Cu plates into molten Al were investigated to analyze the combustion synthesis of Cu-Al intermetallic compounds. From the dipping experiments, it was found that Cu₃Al compound layers were formed between the Cu base metal and the molten Al. The compound formation reactions were able to be almost simulated by calculating the cylindrical model and the flat plate reaction model. However, there are a few differences between Cu wire dipping experiment and Cu plate dipping experiment. Al concentration of Cu₃Al compound phase formed in the Cu wire are higher than that of Cu plate. For the reaction parameters, diffusion coefficient of Al in Cu plate dipping experiment is also higher than that of Cu wire dipping experiment.

For the dipping experiment of Cu wire, the reaction parameters are,

For the dipping experiment of Cu plate, the reaction parameters are,

From analyzing the cylindrical model and the flat plate reaction model, it is guessed the differences were caused by the contact area of Cu/Cu₃Al/Al interface and Al concentration of Cu₃Al phase formed in Cu wires and Cu plates.