Metal Thin Film Deposition Technique for Next-Generation Microelectronics

Abstract

A supercritical carbon dioxide fluid is a compressive high-pressure medium which has a solvent capability, low diffusivity, zero surface tension, and non-toxicity. It enables to deliver chemical reagent for metal thin film deposition deep into complex features so that a conformal film deposition and filling metal into high-aspect holes. The uniqueness of the supercritical carbon dioxide is a key to realize an environmentally-friendly deposition process for future electronic devices.