Removal of Organic Compounds from Metallographic Surfaces Using Cold Concentrated Sulfuric Acid

Abstract

A new convenient method has been developed to remove adhesive organic compounds with high chemical resistance (e.g. epoxy resin) from metallographic surfaces without damaging the surfaces.
Epoxy resin has been found to be readily removed in the following process: 1) rapid cooling in liquid nitrogen and mechanical crushing of bulk resin, 2) swelling the residual resin in an organic solvent, 3) decomposition of the resin in cold concentrated sulfuric acid, 4) washed with saturated aqueous solution of sodium bicarbonate, and 5) blank replica.
This method has been found effective for metals with moderate corrosion resistance.