論 文
Al/Ni瞬間発熱接合体の曲げ強度に及ぼす接合界面状態の影響
キーワード:
Al/Ni multilayer film,
Exothermic reaction,
Reactive soldering,
Four-point bending test,
Bending strength
2019 年 19 巻 1 号 p. 38-43
詳細
2019 年 19 巻 1 号 p. 38-43
In this paper, we describe the effect of controlling reacted NiAl and solder bond interface on bending strength of Al/Ni-reactively-soldered single-crystal Si specimens. The exothermic reaction in Al/Ni multilayer film was used to melt SnAg-solder film for producing Si solder joint. After the instantaneous bonding, Si rod-shaped specimens with the bonded section was prepared by mechanical dicing. Four-point bending test was then conducted to investigate the bending strength and the weakest layer or interface in the bonded section. The specimens with Al/Ni multilayer film deposited in the Al→Ni→…→Al→Ni order fractured at the base-side solder-NiAl interface. By changing the deposition order to Ni→Al→…→Al→Ni, the bending strength of the specimens increased and the fracture origin changed. With the usage of the free-standing film, bending strength increased more. The improvement of mechanical reliability would be caused by a reduction of the number of voids at the solder-NiAl interface.
