2009 年 75 巻 10 号 p. 1206-1210
In the previous report, the new type of dressing method (SADFC dressing method), in which the bond is removed efficiently by circulating the dressing fluid into the contact area between the wheel and the rectangular column type of dressing stick is devised. Using the new dressing method, furthermore, the in-process dressing system in which the dressing fluid is circulated during the grinding operation is manufactured on trial and generally ascertained useful. In the report, the bond removal mechanism in the new dressing and the adequacy of excluding operation of dressing abrasives into wheel-workpiece contact zone are investigated. The dressing force in the new dressing method is much smaller than the popular dressing method in which dressing is done by pressing dressing stick to the wheel. The bond removal is done under a slight fracture and/or fall-off of CBN grains due to small dressing forces to those. The effect of cleaning nozzle used for excluding operation of dressing abrasives into wheel-workpiece contact zone becomes lower for lower table speed in plunge surface grinding. The setting position of cleaning nozzle influences on the effect of excluding operation.