2010 年 76 巻 4 号 p. 458-462
CMP (Chemical Mechanical Polishing) attracts attention as a technology polishing the glass base of the photo mask used for the liquid crystal products. The quartz glass is rubbed up by polishing pad that the chemical liquid slurry is soaked. The slurry has important roles on CMP because it promotes polishing and removing rubbish by flowing between the polishing pad and quartz glass. However, slurry flow can't be observed easily, numerical analysis is useful tool to clarify the slurry flow phenomenon. The lattice grooved pad is paid attention in this study as a basic grooved pad to make the slurry flow efficiency. None grooved pad and the lattice grooved pad are analyzed, and the feature of each pad is clarified. The analysis results show the slurry isn't replaced easily near the pad center under the square quartz glass on flat pad. On the other hand, it becomes easy for the slurry to be transported on lattice grooved pad by the grooves, and it flows to the whole uniformly. When this analysis results are compared with experimental results, they agree qualitatively. Therefore, to supply the slurry uniformly, and to polish efficiently, it has been understood that the lattice grooved pad is excellent.