Abstract
This paper proposes a method to produce saw wires which have dimples on their surface to carry abrasives more effectively into the working gap, leading to improved efficiency and accuracy in slicing hard and brittle materials like monocrystalline silicon. The dimples were formed by electrolyte jet machining which can provide micromachining without causing any micro cracks, thermal damage, or residual stress in the workpiece. A flat electrolyte jet was used to machine dimples on the stretched wire which is traveling with a high speed, regardless of its vibration. The slit nozzle to jet the electrolyte was made by micro electrical discharge machining. Twin jets were used to improve the machining efficiency of dimples.
