A conventional sintered metal bonded grinding wheel is superior in grinding operations on such brittle materials as ceramics, but is not suitable in chip removal for such tenacious materials as steel, because of non-porosity of the wheel. A special porous metal bonded grinding wheel utilizing bonding material of Ni-P alloy was manufactured on trial basis and various mechanical characteristics of the bonding material and the wheel have been already reported in the first report. This special grinding wheel has been subjected to cylindrical plunge cut grinding operations on both-center supported workpieces of such tenacious and brittle materials as carbon steel, cast iron and ceramics. In this report, the grinding performance of this special grinding wheel has been examined in such various factors as grinding force, grinding wheel wear and surface finish and an empirical formula within the tested grinding conditions has been presented on the grinding forces of various materials. It has been proved from this experiment that this special porous metal bonded grinding wheel provides excellent grinding performance in life, grinding ratio, etc, even on tenacious materials.