精密工学会誌
Online ISSN : 1882-675X
Print ISSN : 0912-0289
セラミックスの精密研削における微粒ダイヤモンド砥石の最適研削条件
市田 良夫貴志 浩三蓮田 裕一
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58 巻 (1992) 6 号 p. 1065-1071

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This paper aims to clarify the optimum grinding condition for fine grain diamond wheels in precision grinding of fine ceramics. A series of plunge surface grinding tests on alumina ceramics have been conducted using fine grain diamond wheels with grain size in the range of 2-6to 5-12μm. On the basis of these results, the optimum grinding condition has been evaluated from a veiw point of grinding ratio. The main results obtained in this paper are as follows : (1) When the grinding speed does not exceed about 1 800m/min, the grinding ratio is solely a function of coefficient of grain depth of cut φg= (v/V) √t/D (v; work speed, V; peripheral wheel speed, t; wheel depth of cut, D; wheel diameter) approximately. (2) When φg exceeds a critical value φgc, a transition from attrition to fracture type in the wear mode of diamond wheel occurs. Therefore, the grinding ratio takes a maximum value at the critical condition φggc. The critical Value φgc decreases in proportion to the mean grain diameter of diamond abrasives.

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