超音波平面研削用カップ砥石の開発

CAEシステムによる最適設計

抄録

The study deals with the development of a new cupped diamond wheel used in ultrasonic surface grinding of brittle materials such as fine ceramics. The wheel has a larger diameter and higher stiffness than the usual wheel, therefore it allows the user to grind brittle materials efficiently and precisely. By using the CAE system which has been developed to design an optimal high-intensity ultrasonic system, the wheel is designed optimally so as to resonate in half-wave at the resonance frequency of an employed ultrasonic vibrator. Then, the wheel is produced on the basis of the designed values, its vibrational properties are measured, and the experiments using it in ultrasonic surface grinding are carried out. As a result, the reasonabilities of the designed values are proved, and the potentiality of the wheel is confirmed.