Abstract
Single crystal silicon is machined with a straight-nosed diamond tool and the fundamental machining characteristics are investigated. By obtaining the critical depth of cut based on a simple geometrical model, the effect of crystalline anisotropy on brittle-ductile transition is studied. A homogeneous smooth surface is obtained by controlling the undeformed chip thickness below the minimum critical depth of cut. The cutting chip morphology and machined surface texture with the variation of undeformed chip thickness are observed. An intermediate cutting mode is found to exist between the ductile mode and the brittle mode. Ductile regime turning with generating continuous ribbon chips is realized at a large tool feed rate. By adopting a diamond tool with chamfered rake face, the machined surface roughness is improved.
